Cinch Connectivity Solutions CIN::APSE Solderless, High Density, Custom Interconnects

CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications for Military, Aerospace, Datacom, Satellite and Test Equipment. CIN::APSE is the most widely implemented crimpless and solderless, high speed, interconnect in the industry.