CIN::APSE®

Our industry leading solderless compression connector technology provides high density and high speed solutions for a wide range of custom applications.
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How CIN::APSE® Works

CIN::APSE® Connector Connection The connectors are constructed by two main components, insulating housing and an electrically conducting contact. The liquid crystal polymer insulators are molded and the contacts are a bundled gold-plated molybdenum wire. Gold plated copper spacers are used for long Z-axis connectors.
CIN::APSE® Connector Positioning Positioning The positioning is designed into the insulating housing. Insulation housing are molded for high volume and machined for prototypes.
CIN::APSE® Connector Mounting Mounting The connectors are positioned and mounted between boards and components using generally available alignment and compression hardware. Hardware can be press fit into PCB or utilized with a bolster plate for maintaining even compression across a large socket. Designers recommend PCB layout for gold plated pads and alignment holes locations.
Product Overview It takes more than an ordinary connector to support advanced performance interconnect applications. CIN::APSE® is a proven solderless Z-axis connector technology that offers exceptional mechanical and electrical performance at signals well above 50GHz.
CIN::APSE® Stacking Connector
Stacking Connectors

Stacking connectors for connecting PCB or flex, PCB to PCB or component to PCB without the use of solder.

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CIN::APSE® Stacking Connector Hardware
Stacking Connector Hardware

Hardware that has been designed to maintain uniform compressive force across all contacts.

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CIN::APSE® Stacking Connector Jumpers and Assemblies
Stacking Connector Jumpers and Assemblies

Short flex PCB assemblies for coplanar and right angle board-board connections.

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Applications The CIN::APSE solderless compression connector technology is the most widely implemented crimples and solderless high speed interconnect system for key industries including Commercial Aerospace, Space, Defense, Test & Measurement. Examples of the applications include:
Geostationary Communication Platforms Geostationary Communication Platforms
Inertial Navigation Systems Inertial Navigation Systems
Network Switches Network Switches
Digital Surveillance Systems Digital Surveillance Systems
CPU and ASIC-to-board Connections CPU and ASIC-to-board Connections

Key Features

High Density Icon High Density
  • Maximize SWaP (Size, Weight, and Performance) for space and weight constrained designs
  • Pitch grid of 2.00 mm, 1.0 mm and 0.80 mm achievable
  • Thin profiles from 0.020" and greater
  • 2-piece design reduces additional space and weight
Solderless Icon Solderless
  • Compression sufficient for establishes multiple points of contact, RoHS compatible
  • No thermal processing or X-ray inspection required
  • Reversible mating process for multiple cycles
Customizable Icon Customizable
  • Design team available for mechanical drawings and product sketches
  • Prototypes available for low quantities
  • Profile thicknesses from 0.020" to 1.0"
  • 2 to 7,356 contacts have been used per connector, but no limit exists
  • IC-to-PCB, PCB-to-PCB, Flex-to-PCB, Component-to-PCB
Reliable Icon Reliable
  • Excellent shock and vibration stability, 100 Gs shock, 20 Gs vibration
  • Thermally stable, life and cycle testing, 5,000 hrs @ 170°C
  • Electrically stable, > 1,000 MΩ @ 500 VDC

Discover CIN::APSE®

Watch this video on why CIN::APSE® is the most widely implemented crimpless and solderless, high speed interconnect in the industry.