CIN::APSE®
Our industry leading solderless compression connector technology provides high density and high speed solutions for a wide range of custom applications.
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How CIN::APSE® Works
![CIN::APSE® Connector](/media/images/capability/cin-apse/cin-apse-overview-connectors.jpg)
![CIN::APSE® Connector Positioning](/media/images/capability/cin-apse/cin-apse-overview-positioning.jpg)
![CIN::APSE® Connector Mounting](/media/images/capability/cin-apse/cin-apse-overview-mounting.jpg)
Product Overview
It takes more than an ordinary connector to support advanced performance interconnect applications. CIN::APSE® is a proven solderless Z-axis connector technology that offers exceptional mechanical and electrical performance at signals well above 50GHz.
![CIN::APSE® Stacking Connector](/media/images/capability/cin-apse/cin-apse-product-stacking-connector.jpg)
Stacking Connectors
Stacking connectors for connecting PCB or flex, PCB to PCB or component to PCB without the use of solder.
![CIN::APSE® Stacking Connector Hardware](/media/images/capability/cin-apse/cin-apse-product-stacking-hardware.jpg)
Stacking Connector Hardware
Hardware that has been designed to maintain uniform compressive force across all contacts.
![CIN::APSE® Stacking Connector Jumpers and Assemblies](/media/images/capability/cin-apse/cin-apse-product-stacking-assemblies.jpg)
Stacking Connector Jumpers and Assemblies
Short flex PCB assemblies that are used for coplanar and right angle board to board connections.
Applications
The CIN::APSE solderless compression connector technology is the most widely implemented crimples and solderless high speed interconnect system for key industries including Commercial Aerospace, Space, Defense, Test & Measurement. Examples of the applications include:
Key Features
- Maximize SWaP (Size, Weight, and Performance) for space and weight constrained designs
- Pitch grid of 2.00 mm, 1.0 mm and 0.80 mm achievable
- Thin profiles from 0.020" and greater
- 2-piece design reduces additional space and weight
- Compression sufficient for establishes multiple points of contact, RoHS compatible
- No thermal processing or X-ray inspection required
- Reversible mating process for multiple cycles
- Design team available for mechanical drawings and product sketches
- Prototypes available for low quantities
- Profile thicknesses from 0.020" to 1.0"
- 2 to 7,356 contacts have been used per connector, but no limit exists
- IC-to-PCB, PCB-to-PCB, Flex-to-PCB, Component-to-PCB
- Excellent shock and vibration stability, 100 Gs shock, 20 Gs vibration
- Thermally stable, life and cycle testing, 5,000 hrs @ 170°C
- Electrically stable, > 1,000 MΩ @ 500 VDC